JPH0184472U - - Google Patents
Info
- Publication number
- JPH0184472U JPH0184472U JP1987180416U JP18041687U JPH0184472U JP H0184472 U JPH0184472 U JP H0184472U JP 1987180416 U JP1987180416 U JP 1987180416U JP 18041687 U JP18041687 U JP 18041687U JP H0184472 U JPH0184472 U JP H0184472U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- bending
- slack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180416U JPH0184472U (en]) | 1987-11-26 | 1987-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180416U JPH0184472U (en]) | 1987-11-26 | 1987-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0184472U true JPH0184472U (en]) | 1989-06-05 |
Family
ID=31471938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987180416U Pending JPH0184472U (en]) | 1987-11-26 | 1987-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0184472U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007129087A (ja) * | 2005-11-04 | 2007-05-24 | Nippon Mektron Ltd | 混成多層回路基板およびその製造方法 |
-
1987
- 1987-11-26 JP JP1987180416U patent/JPH0184472U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007129087A (ja) * | 2005-11-04 | 2007-05-24 | Nippon Mektron Ltd | 混成多層回路基板およびその製造方法 |